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电子电路大全(PDF格式)-第61部分
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······························································ （105）
2。3。2 主要性能指标················································································································ （106）
2。3。3 芯片封装与引脚功能···································································································· （106）
2。3。4 内部结构与工作原理···································································································· （107）
2。3。5 应用电路设计················································································································ （109）
2。4 868。35 MHz OOK 接收器芯片RX6501 的原理与应用电路设计············································· （118 ）
2。4。1 概述······························································································································· （118 ）
2。4。2 主要性能指标················································································································ （118 ）
2。4。3 芯片封装及引脚功能···································································································· （119 ）
2。4。4 内部结构与工作原理···································································································· （121）
2。4。5 应用电路设计················································································································ （124）
2。5 250MHz～450MHz ASK 接收器芯片RX3310 的原理与应用电路设计·································· （125）
2。5。1 概述······························································································································· （125）
2。5。2 主要性能指标················································································································ （125）
2。5。3 芯片封装与引脚功能···································································································· （126）
2。5。4 内部结构与工作原理···································································································· （127）
2。5。5 应用电路设计················································································································ （127）
2。6 315MHz 遥控无键进入系统接收器模块DK1000R 的原理与应用电路设计·························· （129）
2。6。1 概述······························································································································· （129）
2。6。2 主要技术指标················································································································ （129）
2。6。3 模块封装与引脚功能···································································································· （130）
2。6。4 内部结构与工作原理···································································································· （132）
2。6。5 应用电路设计················································································································ （133）
2。7 300MHz～450MHz ASK 接收器芯片U3745BM 的原理与应用电路设计······························ （136）
·III ·
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2。7。1 概述······························································································································· （136）
2。7。2 主要性能指标················································································································ （136）
2。7。3 芯片封装与引脚功能···································································································· （137）
2。7。4 内部结构与工作原理···································································································· （137）
2。7。5 应用电路设计················································································································ （144）
第3 章 射频收发器芯片原理与应用电路设计································································· （153）
3。1 300MHz～500MHz 无线收发芯片MICRF501 的原理与应用电路设计·································· （153）
3。1。1 概述······························································································································· （153）
3。1。2 主要性能指标················································································································ （153）
3。1。3 芯片封装与引脚功能···································································································· （154）
3。1。4 内部结构与工作原理···································································································· （155）
3。1。5 应用电路设计················································································································ （156）
3。2 300MHz～930MHz FSK/FM/ASK 收发器芯片 TH7120 的原理与应用电路设计·················· （168）
3。2。1 概述······························································································································· （168）
3。2。2 主要技术指标················································································································ （169）
3。2。3 芯片封装与引脚功能···································································································· （169）
3。2。4 内部结构与工作原理···································································································· （170）
3。2。5 应用电路设计················································································································ （175）
3。3 OOK/ASK 868。35 MHz 收发器芯片TR1001 的原理与应用电路设计···································· （182）
3。3。1 概述······························································································································· （182）
3。3。2 主要技术指标················································································································ （183）
3。3。3 芯片封装及引脚功能···································································································· （183）
3。3。4 芯片内部结构及工作原理····························································································· （186）
3。3。5 应用电路设计················································································································ （190）
3。3。6 DR3001 模块················································································································· （192）
3。4 868MHz ASK/FSK 无线收发器芯片TDA 5250 的原理与应用电路设计································ （194）
3。4。1 概述······························································································································· （194）
3。4。2 主要技术指标················································································································ （194）
3。4。3 芯片封装与引脚功能···································································································· （195）
3。4。4 内部结构与工作原理···································································································· （197）
3。4。5 应用电路设计················································································································ （200 ）
3。5 433/870/915MH FSK 收发器芯片XE1202 的原理与应用电路设计······································· （204 ）
3。5。1 概述···················································································�
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